Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T

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Shichun Qu,Yong Liutific disciplines and a resurgence of interest in the modern as well as the clas­ sical techniques of applied mathematics. This renewal of interest, both in research and teaching, has led to the establishment of the series Texts in Applied Mathematics (TAM). The development of new courses is a natur

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Shichun Qu,Yong Liu is unknown to you, you must take the road that is unknown to you St. John of the Cross This is a book on the numerical approximation ofpartial differential equations (PDEs). Its scope is to provide a thorough illustration of numerical methods (especially those stemming from the variational formulat

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Shichun Qu,Yong Liu multiple shooting, collocation and other local discretizations can share a common structure. The identification of this common structure permits us to analyse how various components of a method interact and also permits us to consider the assembly of a collection of modular routines which will even

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