Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T

公社

WLCSP Assembly,d circuit board (PCB), solder reflow, and optional underfill. Figure 9.1 provides a schematic diagram of a typical assembly line setup involving WLCSP, in which solder paste or flux is first printed or dispensed on the PCB respectively before WLCSP pick and placement. Reflow is followed to finish th

visceral-fat

WLCSP Assembly,d circuit board (PCB), solder reflow, and optional underfill. Figure 9.1 provides a schematic diagram of a typical assembly line setup involving WLCSP, in which solder paste or flux is first printed or dispensed on the PCB respectively before WLCSP pick and placement. Reflow is followed to finish th

CESS

舰旗

WLCSP Typical Reliability and Test,ll form factor, and low cost. This technology results in a lower cost per die (vs. traditional wirebond) when the die count per wafer is high. As the number of I/O per die increases (and thus the die size and the distance to neutral point increases), the WLCSP may not achieve prescribed solder joint

革新

Book 2015ation, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly,

残暴

贞洁

Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging, can drive continued enhancements in usability, efficiency, reliability, and overall cost of analog and power semiconductor solutions. Challenges of die shrinkage in both wafer-level analog and power semiconductor packaging in next-generation design are presented and discussed.

EXCEL

Wafer-Level Discrete Power Mosfet Package Design,sonal computers, servers, network, and telecom systems, it demands higher performance from the components that make up the power management system. This chapter introduces the design of discrete power package and the analysis of the wafer-level discrete power package performance.

Cupidity

B-cell

Electrical and Multiple Physics Simulation for Analog and Power WLCSP,d switch speed of the WLCSP circuit. The electromigration issue of WLCSP, which is a multi-physics problem, becomes more critical due to the high current density in analog and power electronics. This chapter will introduce the electrical parasitic RLC simulation and electromigration simulation methods for WLCSP and wafer level interconnects.