Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T

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duces the development of the analog and power SIP/3D/TSV/staAnalog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP pack

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Thermal Management, Design, and Analysis for WLCSP,device induces an increase in the junction temperature. This depends on the amount of power dissipation and the thermal resistance between the junction and the WLCSP bumps, an ambient, and some other specified reference point. This chapter introduces the thermal management, design, analysis, and cooling methods for WLCSP.

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Shichun Qu,Yong Liuve a linear integral equation, which is then solved by the Tikhonov method with the identity as the regularization operator. We prove in this paper that the resulting equation is well-condition and has clustered spectrum. Hence if the conjugate gradient method is used to solve the equation, we expec

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Shichun Qu,Yong Liuot taken into account. A way to derive an enhanced constitutive model for masonry, closely related to the behaviour of its constituent materials (mortar and bricks) and to its geometry (bond pattern, thickness of the mortar joints, etc.), is to take advantage of the homogenization techniques, which

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Shichun Qu,Yong Liual students at the University of Michigan, none of the existing texts seemed exactly right. On the one hand, the many decent, even inspiring, books on elementary computational statistics stress the nuts and bolts of using packaged programs and emphasize model interpretation more than numerical analy