Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1982 Van Nostrand Reinhold Company Inc. 1982 control.de

electrolyte

担忧

cortisol

Iniquitous

Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be us

grandiose

Fabrication Processes,ials used with the processes, and the equipment available for each operation. All materials and processes used have certain restrictions; the designer must be aware of these to avoid the possibility of designing hardware that cannot be manufactured by current standard processes or equipments. A thor

禁止,切断

Subassemblies and Assemblies,le to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency c

Offensive

Design Considerations for Space Electronics,cuits primarily for the earthbound electronics industry; if their packages were destined for use in aircraft, the greatest worry was vibration. For a majority of the products, all that was needed to package was an aluminum chassis, some protection against shock and vibration, an occasional tube shie

Ballad

Environmental Protection,d dust are directly attributable to a large number of failures in electronics systems. In Chapters 8 and 12, equipment enclosures are discussed. The material presented in this chapter covers both organic and inorganic environmental coatings commonly used to protect materials and assemblies from hars

幻想

Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.

渗入