找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1982 Van Nostrand Reinhold Company Inc. 1982 control.de

[复制链接]
楼主: Corrugate
发表于 2025-3-23 11:12:28 | 显示全部楼层
Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be useful in estimating future tasks.
发表于 2025-3-23 15:06:45 | 显示全部楼层
Subassemblies and Assemblies,le to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency controlling, etc. (Figures 8-2 and 8-3).
发表于 2025-3-23 21:31:35 | 显示全部楼层
发表于 2025-3-24 01:27:55 | 显示全部楼层
Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.
发表于 2025-3-24 06:18:38 | 显示全部楼层
Materials and Processes, and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.
发表于 2025-3-24 08:24:05 | 显示全部楼层
发表于 2025-3-24 14:05:57 | 显示全部楼层
https://doi.org/10.1007/978-3-642-17952-5The electronics packaging design and engineering fields perform tasks of ever-increasing importance in the electronics industry. They can be either the strength or the weakness of electronics systems engineering. Much depends on how its purpose and functions are interpreted within the engineering organization.
发表于 2025-3-24 17:53:35 | 显示全部楼层
https://doi.org/10.1007/978-3-031-30142-1The human engineering design guidelines presented in this chapter are directed toward hardware problems involving man-machine interfaces. When the engineer or designer cannot find an adequate solution herein, a human factors specialist should be consulted.
发表于 2025-3-24 20:04:01 | 显示全部楼层
https://doi.org/10.1007/978-3-030-56001-0Reliability is one of the prime requirements in the design of electronics equipment. Reliability is the ability of a product to perform as designed for the specified life of the equipment.
发表于 2025-3-25 01:28:12 | 显示全部楼层
https://doi.org/10.1057/978-1-349-95053-9The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-5-10 22:07
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表