Overview: Addresses advanced semiconductor packaging both in theory and practice.Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging techThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale pa
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