Titlebook: Semiconductor Advanced Packaging; John H. Lau Book 2021 The Editor(s) (if applicable) and The Author(s), under exclusive license to Spring

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System-in-Package (SiP),eless stereo), etc. The key assembly processes of SiP technology are basically SMT (surface mount technology) and flip chip technology, which will be presented and discussed in this chapter. The difference between the SoC (system-on-chip) and SiP, the intention and actual applications of SiP, and so

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Hybrid Bonding,own in Chaps. ., ., and .. There are at least two different Cu–Cu bondings, namely Cu–Cu thermal compression bonding (TCB) [.,.,.,.,.,.,.,.,.,.,.] and low-temperature direct bond interconnect (hybrid bonding) [.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.]. Most Cu–Cu TCBs operate at high temp

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Chiplet Heterogeneous Integration,[.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.,.]. Microprocessors such as AMD’s EPYZ and Intel’s Lakefield are in high volume manufacturing with chiplet designs and heterogeneous integration packaging technology. They will be discussed in this chapter. The definition and advantages/disadvantages of chiplet het

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Book 2021ciples and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D,

尾随

reliability of various advanced semiconductor packaging techThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineerin

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deutschsprachige Edition seiner eher verstreut publizierten Beiträge in den . bzw. . in den 60er bzw. Anfang der 70er Jahre und nicht zuletzt durch die Veröffentlichung des abschließend geplanten, durch den frühen Tod jedoch nicht mehr vollendeten, von seinem Schüler Thomas Luckmann anhand der Vorl

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