| 书目名称 | Semiconductor Advanced Packaging | | 编辑 | John H. Lau | | 视频video | | | 概述 | Addresses advanced semiconductor packaging both in theory and practice.Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging tech | | 图书封面 |  | | 描述 | The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. | | 出版日期 | Book 2021 | | 关键词 | System-in-Package; Flip Chip Technology; Thermocompression Bonding and Chip-to-Wafer Bonding; Wafer-to- | | 版次 | 1 | | doi | https://doi.org/10.1007/978-981-16-1376-0 | | isbn_softcover | 978-981-16-1378-4 | | isbn_ebook | 978-981-16-1376-0 | | copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor |
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发表于 2025-3-21 17:27:23
