Titlebook: Semiconductor Advanced Packaging; John H. Lau Book 2021 The Editor(s) (if applicable) and The Author(s), under exclusive license to Spring

acclimate

来就得意

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ABYSS

外观

Fan-In Wafer/Panel-Level Chip-Scale Packages,First of all, as the name “fan-in wafer/panel-level chip-scale packages” indicates that packages are fabricated on a wafer or panel.

切割

单调性

2D, 2.1D, and 2.3D IC Integration,In this chapter, 2D, 2.1D, and 2.3D IC integrations will be discussed. In 2D IC integration, wire bonding, flip chip, a mix of wire bonding and flip chip, fan-out with chip-first, fan-out with chip-last, and fan-out with chip-last on hybrid RDLs will be presented.

松软

2.5D IC Integration,The 2.5D IC integration defined by the electronic semiconductor industry as chips are supported by a passive TSV (through-silicon via) interposer.