Titlebook: Solder Joint Reliability; Theory and Applicati John H. Lau Book 1991 Springer Science+Business Media New York 1991 assembly.circuit.coating

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Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction,ring a reliable product will be substantially reduced. It is not surprising, therefore, that a great deal of effort is currently being applied to mechanical modeling. of electronic packages with surface mounted devices with the aim of understanding and improving fatigue life of solder joints.

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Flux Reactions and Solderability,y appear to work. This chapter is not a discussion of what fluxes are available for electronics soldering, of how they are classified, or how they are used or applied. It does not comment about the perceived relative merits of the various types available.

annexation

Solder Paste Technology and Applications,opments. Most recently, the strongest trend in the design and manufacture of electronics packages is the application of surface mount technology in lieu of conventional through-hole technology in populating printed circuit boards. As the name implies, surface mount technology involves placing compon

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Post-Solder Cleaning Considerations,ability. In fact, it is necessary to choose the appropriate cleaning strategy by taking into account the activity and the composition of the soldering flux used. Residue remaining from either the flux or the cleaning agent or a combination of the two can affect the reliability of the circuit board.

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Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Soldents working in partnership. These two instruments operate simultaneously to complement each other’s data acquisition, guided by the instrumental operator. Scanning electron microscopy (SEM) provides an image (i.e., morphological information or surface features) on a magnified scale—X10 to X100,000,

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