Titlebook: Solder Joint Reliability; Theory and Applicati John H. Lau Book 1991 Springer Science+Business Media New York 1991 assembly.circuit.coating

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Microstructure and Mechanical Properties of Solder Alloys, the resistance of the joint to mechanical rupture under short-term direct loading, as might occur during impact testing. If the solder joint is subjected to cyclic stresses and strains generated by thermal expansions during thermal cycling, the reliability depends on resistance to fatigue. Because

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Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data, component to the board. With surface mounting, the joints serve as the mechanical as well as the electrical connection for the component. As such, they must accommodate any relative displacement between the component and the board and support the stresses that are developed by this displacement.

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Book 1991mponents. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me­ chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica­ tions as wel

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