Titlebook: Solder Joint Reliability; Theory and Applicati John H. Lau Book 1991 Springer Science+Business Media New York 1991 assembly.circuit.coating

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Solder Attachment Reliability, Accelerated Testing, and Result Evaluation,l shunts, bonding layers between a printed circuit board and a heat sink, leads soldered into plated through holes (PTHs), chip solder attachments (flip-chip or C4), or surface mount (SM) solder joints.

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ctronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me­ chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica­ ti

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Methods in Molecular Biology™ series format, chapters include introductions to their respective topics, lists of the necessary materials and reagents, step-by-step, readily reproducible laboratory protocols, a978-1-4939-6117-7978-1-60761-762-4Series ISSN 1064-3745 Series E-ISSN 1940-6029

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James L. Marshall Methods in Molecular Biology™ series format, chapters include introductions to their respective topics, lists of the necessary materials and reagents, step-by-step, readily reproducible laboratory protocols, a978-1-4939-6117-7978-1-60761-762-4Series ISSN 1064-3745 Series E-ISSN 1940-6029

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