| 书目名称 | Silver Metallization | | 副标题 | Stability and Reliab | | 编辑 | Daniel Adams,Terry L. Alford,James W. Mayer | | 视频video | | | 概述 | First book to discuss current knowledge of silver metallization and its potential as a favourable candidate for implementation as a future interconnect material for integrated circuit technology.Valua | | 丛书名称 | Engineering Materials and Processes | | 图书封面 |  | | 描述 | .Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology...Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: - preparation and characterization of elemental silver thin films and silver-metal alloys; - formation of diffusion barriers and adhesion promoters; - evaluation of the thermal stability of silver under different anneali | | 出版日期 | Book 2008 | | 关键词 | Diffusion; PAS; integrated circuit; metal; static-induction transistor; thin films | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-84800-027-8 | | isbn_softcover | 978-1-84996-705-1 | | isbn_ebook | 978-1-84800-027-8Series ISSN 1619-0181 Series E-ISSN 2365-0761 | | issn_series | 1619-0181 | | copyright | Springer-Verlag London 2008 |
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发表于 2025-3-21 17:54:40
