找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Semiconductor Device Reliability; A. Christou,B. A. Unger Book 1990 Kluwer Academic Publishers 1990 ASIC.CMOS.LED.Laser.Standard.Transisto

[复制链接]
楼主: 导弹
发表于 2025-3-26 23:42:55 | 显示全部楼层
A Review of the Reliability of III–V Opto-electronic Componentsphotodiodes for use in optical fibre transmission systems. Results are presented which show that these components are capable of the high reliability needed for telecommunications use, but that they are still vulnerable to a number of failure mechanisms. Reliability assessment, failure analysis and
发表于 2025-3-27 04:31:41 | 显示全部楼层
Considerations on the Degradation of DFB Lasersodes. The change in spectral characteristics during operation and the electric surge endurance level is also presented..The failure modes are similar to those of FP lasers. The degradation speed mainly depends on the injected current density and is affected by BH interface degradation. The median li
发表于 2025-3-27 06:26:13 | 显示全部楼层
发表于 2025-3-27 12:53:21 | 显示全部楼层
Modelling the Effects of Degradation on the Spectral Stability of Distributed Feedback Lasersare presented of the effects on uniform grating and λ/4 phase shift DFB lasers of changes made in localised injected current density and in lifetime of carriers for linear non-radiative recombination. The aim of the work is to evaluate modelling as a technique for comparing the susceptibility of dif
发表于 2025-3-27 15:20:05 | 显示全部楼层
Gate Metallisation Systems for High Reliability GaAs MESFET Transistors and WSi.. The work carried out in this area will be reviewed and appraised. The basic interface has been characterised by the use of RBS and SIMS studies. More recent studies have been concerned with the use of these results in the fabrication and evaluation of transistor structures.
发表于 2025-3-27 21:05:48 | 显示全部楼层
发表于 2025-3-28 00:24:33 | 显示全部楼层
发表于 2025-3-28 02:49:54 | 显示全部楼层
The Influence of Temperature and Use Conditions on the Degradation of Led Parametersce of technology and manufacturer is presented. The quality and reliability of devices based on failure analysis are often more related to external causes than due to intrinsic reliability of the semiconductor.
发表于 2025-3-28 07:17:55 | 显示全部楼层
发表于 2025-3-28 13:57:06 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-5-1 16:03
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表