| 书目名称 | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication |
| 副标题 | From Particle Scale |
| 编辑 | Jianfeng Luo,David A. Dornfeld |
| 视频video | http://file.papertrans.cn/469/468557/468557.mp4 |
| 概述 | First book dedicated to the modeling of CMP for sub-micron integrated circuit (IC) fabrication.Modeling and simulation are critical to transfer CMP from an engineering ‘art’ to an engineering ‘science |
| 图书封面 |  |
| 描述 | Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston‘s equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process in |
| 出版日期 | Book 2004 |
| 关键词 | CMP; FEM; Fabrication; Mechanical Model; Production; REM; STEM; Semiconductor Technology; Wafer; integrated c |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-3-662-07928-7 |
| isbn_softcover | 978-3-642-06115-8 |
| isbn_ebook | 978-3-662-07928-7 |
| copyright | Springer-Verlag Berlin Heidelberg 2004 |
|Archiver|手机版|小黑屋|
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