Titlebook: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication; From Particle Scale Jianfeng Luo,David A. Dornfeld

思考才皱眉

Book 2004in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficie

使害羞

Wafer-Scale Modeling of CMP,egions where the material is removed faster. This causes a degradation of the circuit performance there. The WIWNU will also bring a systematic variation of the circuit performance across the wafer. A better understanding of the mechanisms driving the WIWNU will help to increase the yield and improve the circuit performance.

GILD

Introduction,fer materials and planarize the wafer surface. A typical configuration of a rotational type CMP machine, where the relative movement is obtained from the rotations of the wafer carrier (polishing head) and polishing platen around their own centers, is shown schematically in Fig. 1.1 ..

delegate

https://doi.org/10.1007/978-3-662-07928-7CMP; FEM; Fabrication; Mechanical Model; Production; REM; STEM; Semiconductor Technology; Wafer; integrated c

畏缩

Jianfeng Luo,David A. DornfeldFirst book dedicated to the modeling of CMP for sub-micron integrated circuit (IC) fabrication.Modeling and simulation are critical to transfer CMP from an engineering ‘art’ to an engineering ‘science

genuine

宣传

978-3-642-06115-8Springer-Verlag Berlin Heidelberg 2004

A简洁的

Review of CMP Modeling,Although chemical mechanical planarization (CMP) is widely applied in integrated circuit fabrication, it is still a process of trial and error. Understanding the basic mechanism of this process has initiated research efforts from both industry and academia in the last decade. This chapter reviews previous CMP modeling efforts.

Nonporous

Summary and Future Work,Chemical mechanical planarization models at three scales, namely, particle scale, feature and die scales and wafer scale, are presented in this work.

diathermy

Book 2004ls which have not kept pace with the tremendous expansion of applications of CMP. Preston‘s equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process in