Titlebook: Structural Integrity and Reliability in Electronics; Enhancing Performanc W. J. Plumbridge,R. J. Matela,A. Westwater Book 2003 Springer Sci

Deduct

More Complex Mechanical Behaviouron (creep) may take place by several mechanisms, each governed by different parameters and expressions. Fatigue endurance may be affected by the presence of dwells in the strain-time cycle, and the specific failure process, involving crack growth, may be strongly influenced by intermetallic compound

Connotation

Mechanical Testing (For Electronics Applications)irect measurements of stress and strain from the gauge length of the specimen avoid uncertainties about test machine flexibility and stress or strain distribution around the specimen shoulders. In this regard, they are preferred for the evaluation of ...Soldered interconnections may be 100–1000 time

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