Titlebook: Structural Integrity and Reliability in Electronics; Enhancing Performanc W. J. Plumbridge,R. J. Matela,A. Westwater Book 2003 Springer Sci

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efined and characterized in terms of entanglement.  Part IV shows that the key entanglement structure of topological states can be captured using the tensor network representation, which provides a powerful too978-1-4939-9084-9Series ISSN 2364-9054 Series E-ISSN 2364-9062

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Mechanical Testing (For Electronics Applications) significant shortcoming. It is becoming increasingly recognised that mechanical property information on components and interconnections has a valuable contribution to make to reliable life prediction and design.

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https://doi.org/10.1007/1-4020-2611-0Statistica; alloy; calculus; circuit; communication; construction; design; electronics; environment; finite e