Titlebook: Soybean Improvement; Physiological, Molec Shabir Hussain Wani,Najeeb ul Rehman Sofi,Feng Lin Book 2022 The Editor(s) (if applicable) and Th

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Gyanesh Kumar Satpute,Ruchi Shroti,Nishtha Shesh,Viraj G. Kamble,Rucha Kavishwar,Milind B. Ratnaparknes are given to determine optimal particle size and to estimate particle flow following fidelity..Advances in post processing algorithms provide improvements in velocity accuracy and spatial resolution. The correlation-averaging algorithm increases the effective particle concentration, while mainta

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Subhash Chandra,Reecha T. Das,Shivani Nagar,G. K. Satpute,G. Kumawat,M. B. Ratnaparkhe,Sanjay Gupta,nes are given to determine optimal particle size and to estimate particle flow following fidelity..Advances in post processing algorithms provide improvements in velocity accuracy and spatial resolution. The correlation-averaging algorithm increases the effective particle concentration, while mainta

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Vijayata Singh,Jogendra Singh,Awtar Singhnes are given to determine optimal particle size and to estimate particle flow following fidelity..Advances in post processing algorithms provide improvements in velocity accuracy and spatial resolution. The correlation-averaging algorithm increases the effective particle concentration, while mainta

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Ammar Ali,Zaheer Ahmed,Rizwana Maqbool,Khurram Shahzad,Akhtar Hameed,Faisal Saeed Awan,Azeem Iqbal Kues for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing

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Adhimoolam Karthikeyan,Chandran Sarankumar,Natesan Senthilues for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing

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ues for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing