Titlebook: Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits; Nishath K. Verghese,Timothy J. Schmerbeck,David J. B

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Controlling Substrate Coupling in Heavily-Doped Bulk Processes,roportional to the total chip switching power as well as to the logic power rail inductance and chip substrate tie inductance. Coupled noise peak voltages are frequency dependent, unlike the coupled energy, due to constructive and destructive interference of the various frequencies.

INCUR

Chip/Package Shielding and Good Circuit Design Practice,e usual definition of far field radiated noise isthat the distance from source.Antenna length, L~> λ (wavelength) for an EFFICIENT antenna.A “rule of thumb” to minimize radiated emissions is to keep the chip package linear dimensions.and to keep the chip/package.▪ An example:

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Introduction,equired to combine significant portions of analog circuits with the purely digital switching functions. Current IC and packaging geometries have been miniaturized to the point that, at high speeds, even pure CMOS logic designs are being limited by crosstalk and inductive switching noise problems. Ad

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谄媚于性

,,e node model for such substrates is that, once characterized for a particular process it can readily be used for any circuit structure that uses the same process, irrespective of size. Unfortunately the model does not extend to processes which do not have a heavily-doped bulk which is in effect a co