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Titlebook: Silicon Sensors and Actuators; The Feynman Roadmap Benedetto Vigna,Paolo Ferrari,Sarah Zerbini Book 2022 Springer Nature Switzerland AG 202

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Linear and Nonlinear Mechanics in MEMSices like micromirrors, pressure sensors, ultrasonic transducers. Design for reliability in MEMS implies a good knowledge of all mechanical features, of multi-physics interactions and of various nonlinear responses that can arise in MEMS. A careful, in deep knowledge of intriguing nonlinear mechanic
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Inertial Sensorsto the current pervasion in consumer, automotive, and Industrial applications..The main working principles and design considerations regarding MEMS accelerometers and gyroscopes are described in Sects. . and ., with emphasis on the interaction between process parameters and product performances..Sec
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Magnetometerss, which is fundamental for navigation and map heading. On the other hand, magnetometers are often included together with magnets in systems monitoring a position or an angle in industrial and automotive applications, such as ABS wheel speed monitoring, steering angle measurement, or electrical moto
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Pressure Sensorster, an overview of the evolution of the technology will be presented, with a primary focus on piezoresistive and capacitive technologies. Key figures of both technologies will be introduced, with a comparison of the advantages and disadvantages between them. Moreover, the key technological modules
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HF ReleaseMS devices are also described. Finally, two cases of wet release will be presented: a MEMS PMUTs (Piezoelectric Micro Machined Ultrasound Transducer) for 3D gesture recognition and a more complicated MEMS microphone with two membranes to release on one movable (the sensing) and one fixed (the reference).
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Pressure Sensorsof ST pressure sensors will be introduced: The VENSEN technology, which enables the large-scale fabrication of monocrystalline silicon membranes above an air cavity; or the BASTILLE technology, which suspends the pressure sensing element with an architecture based on springs to decouple it mechanically from package-related stress.
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Book 2022aders will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the autho
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