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Titlebook: Silicon Sensors and Actuators; The Feynman Roadmap Benedetto Vigna,Paolo Ferrari,Sarah Zerbini Book 2022 Springer Nature Switzerland AG 202

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书目名称Silicon Sensors and Actuators
副标题The Feynman Roadmap
编辑Benedetto Vigna,Paolo Ferrari,Sarah Zerbini
视频video
概述Provides a systematic overview of sensor and actuator technology.Written by industry thought leaders and technical experts from STMicroelectronics.Introduces the ‘’Feynman Roadmap’’ to the future of s
图书封面Titlebook: Silicon Sensors and Actuators; The Feynman Roadmap Benedetto Vigna,Paolo Ferrari,Sarah Zerbini Book 2022 Springer Nature Switzerland AG 202
描述.This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book..
出版日期Book 2022
关键词Actuators; Electronic Interfaces; Fabrication; Mechanical Material; MEMS; Micro Mechanical Transducers; Mi
版次1
doihttps://doi.org/10.1007/978-3-030-80135-9
isbn_softcover978-3-030-80137-3
isbn_ebook978-3-030-80135-9
copyrightSpringer Nature Switzerland AG 2022
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Thin Film Depositionches such as Low Pressure CVD (LPCVD) and Plasma Enhanced CVD (PECVD) with a special focus on the materials of interest for MEMS devices. LPCVD is the reference technique for the deposition of polysilicon membranes and thick low stress silicon nitride that are essentials for the fabrication of MEMS
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Optical Lithographyeakers, require the development of dedicated lithography steps to define the mechanical structures. New challenges related to MEMS lithography emerge and they are quite different from those of standard electronics. This chapter presents an introduction to different lithography applications related t
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HF Releaseve is the “release process”. In this chapter, the release process, using hydrofluoric acid, is described. The topics covered concern the dry and wet phase process, the process set up, and in-line process monitoring and characterization. Phenomena of stiction, a notorious case of malfunctioning of ME
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Galvanic Growthth techniques are suitable for MEMS application, depending on the desired deposit proprieties and on the required integration process. Deposition rate in electroless processes is generally quite slow, so for thick deposits, Electro-Chemical Deposition (ECD) is usually preferred. Furthermore, when th
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Wet Etching and Cleaningnd refining steps, preparatory to other key processes. All wet processes are fundamentally hinged on chemical and physical properties of specific liquid formulations in which each component, solvent or chemically active species, is chosen to selectively attack (etch) or remove (clean) target materia
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