Titlebook: Reliable Design of Electronic Equipment; An Engineering Guide Dhanasekharan Natarajan Book 2015 Springer International Publishing Switzerla

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Selection and Application of Components,ve components are listed. Guidelines for deciding the quantum of de-rating for the stress factors are provided. Application information for the components is also presented and they are based on the application notes of manufacturers, literature, and root cause analysis on component failures.

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Overview of Reliability Design,analyses, internal electrical, and environmental testing superimposed with reliability improvement tests, and qualification testing. Brief explanation for the reliability techniques and methods of integrating the techniques with the design and development of an electronic item are presented.

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Failure Mode and Effects Analysis,. The terms, the benefits, and the application of FMEA are explained with examples from electronic designs for the benefit of circuit designers. FMEA improves the competence of designers and enhances the reliability and maintainability (R&M) of equipment. The documentation of FMEA becomes an asset to organizations.

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Generic Stress Factors and De-rating,ress factors of electronic components. The generic stress factors, ambient temperature, surface temperature, and junction temperature that are common to most components are explained with examples. The basics of de-rating, applying de-rating for stress factors, and thermal resistance are also explained.