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Titlebook: Reliable Design of Electronic Equipment; An Engineering Guide Dhanasekharan Natarajan Book 2015 Springer International Publishing Switzerla

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楼主: tricuspid-valve
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ed with positivism, of modern technology as a mere application of science. I examine how and to what extent three French philosophers pursued non-Comtean insights into the relations between science and technology: some decades before the emerging STS wave that swept in as the 1970s wound down, they
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g.Provides comprehensive presentation with applications and This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable elect
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Generic Stress Factors and De-rating,ress factors of electronic components. The generic stress factors, ambient temperature, surface temperature, and junction temperature that are common to most components are explained with examples. The basics of de-rating, applying de-rating for stress factors, and thermal resistance are also explai
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Failure Mode and Effects Analysis,heir consequences for achieving total reliability. All engineers without exception do apply FMEA in the design of electronic equipment to prevent obvious design errors, and examples are provided for the application. However, the detection of latent design errors requires applying FMEA systematically
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Failure Data Management,onic equipment. The failures are categorized as electrical performance, component and mechanical failures. Organizing a failure data management system (FDMS) to handle the failure data is presented. Practical considerations for the root cause analysis of component failures and classifying the origin
发表于 2025-3-25 01:09:01 | 显示全部楼层
Reliability Database System for Design,evelopment activities of electronic equipment. Designing the database system to provide support for the application of components, overstress analyses, FMEA, internal verification testing, qualification testing, and failure analysis reports is explained.
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