Titlebook: MEMS Materials and Processes Handbook; Reza Ghodssi,Pinyen Lin Book 2011 Springer Science+Business Media, LLC 2011

刀锋

magnanimity

Doping Processes for MEMS,cesses are used in MEMS devices for creating electrically conductive layers for power distribution, heaters, transducers, and other structures. Doped layers are also widely used for controlling specialty etch processes by modification of surface electrochemistry. Typical MEMS doping applications, st

interference

Wafer Bonding,onding can be divided into two technological groups: direct bonding and intermediate layer bonding. Direct bonding relies on the cohesive bond that is formed when the surfaces of two wafers are brought together under specific temperature and pressure conditions. Direct bonding relies on critical par

使成波状

MEMS Packaging Materials,n the packaging of MEMs are reviewed and their respective applications. The packaging schemes for these devices owe their infrastructure base to the body of knowledge surrounding semiconductors and microcircuits. MEMS devices yield new complexities which drive new packaging solutions. As opposed to

embolus

加入

烧烤