Titlebook: MEMS Materials and Processes Handbook; Reza Ghodssi,Pinyen Lin Book 2011 Springer Science+Business Media, LLC 2011

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Additive Processes for Semiconductors and Dielectric Materials,s used in the fabrication of microelectromechanical systems (MEMS). These methods include chemical vapor deposition, epitaxy, physical vapor deposition, atomic layer deposition, and spin-on techniques. The materials featured in this chapter include silicon and its oxide, nitride, and carbide derivat

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Additive Processes for Metals,ommon examples include electrical conductors, mechanical structures, magnetic elements, thermal conductors, optical reflectors, and more. In this chapter, additive processes for metals are discussed in the context of their application in MEMS. Particular attention is paid to MEMS-centric processing

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Additive Processes for Piezoelectric Materials: Piezoelectric MEMS,nd reliable piezoelectric thin films have limited the incorporation of piezoelectric thin films in MEMS. Advances in materials processing and a move toward system-in-package (SIP) concepts have pushed piezoelectric thin film devices toward mainstream acceptance. The advances in piezoelectric aluminu

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Dry Etching for Micromachining Applications,l systems. Dry etching processes consist of (1) purely chemical (spontaneous gas phase etching), (2) purely physical (ion beam etching or ion milling), and (3) a combination of both methods (reactive ion or plasma etching) for the controlled removal of desired substrate materials. Although some of t

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