Titlebook: MEMS Materials and Processes Handbook; Reza Ghodssi,Pinyen Lin Book 2011 Springer Science+Business Media, LLC 2011

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书目名称MEMS Materials and Processes Handbook影响因子(影响力)学科排名




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书目名称MEMS Materials and Processes Handbook网络公开度学科排名




书目名称MEMS Materials and Processes Handbook被引频次




书目名称MEMS Materials and Processes Handbook被引频次学科排名




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书目名称MEMS Materials and Processes Handbook年度引用学科排名




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书目名称MEMS Materials and Processes Handbook读者反馈学科排名

paradigm

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Additive Processes for Piezoelectric Materials: Piezoelectric MEMS,ostatically driven MEMS resonator and filters operating in cellular phone frequency bands (nominally 0.7–6 GHz). In addition to FBAR technology, piezoelectric actuation/sensing is being examined for a host of applications including RF MEMS, small-scale robotics, resonant mass sensors, and energy har

Chronic

Dry Etching for Micromachining Applications,the reader with a broad understanding of the parameters that influence the results in dry etching techniques and to provide information that is useful to explore dry etching processes for the fabrication of next-generation MEMS devices. Practical recipes suitable for most commonly used plasma reacto

茁壮成长

装入胶囊

MEMS Lithography and Micromachining Techniques,n beam lithography, and nanoimprint lithography. This chapter presents an introduction and practical approach to lithography and micromachining techniques in the context of MEMS device fabrication. The topics that are discussed here include: UV lithography, grayscale lithography, e-beam lithography,

malign

Wafer Bonding,devices, to encapsulate the MEMS device in an hermetic environment, and to transfer bond a complete MEMS device to a wafer with integrated circuits. Wafer bonding has found its earliest applications for pressure sensors and accelerometers, but the applications remain boundless.

连锁,连串

MEMS Packaging Materials,ging also provides mechanical support to the sensitive chip, facilitating the handling of the chip, and simplifying assembly. This chapter emphasizes the materials involved in packaging MEMS devices and the addresses the challenges involved. Included in this chapter are several case studies demonstr

Encephalitis

大骂