书目名称 | Low Dielectric Constant Materials for IC Applications | 编辑 | Paul S. Ho,Jihperng Jim Leu,Wei William Lee | 视频video | http://file.papertrans.cn/589/588762/588762.mp4 | 概述 | First one in the emerging field of low dielectric constant materials.There is worldwide a big need for such a book.Includes supplementary material: | 丛书名称 | Springer Series in Advanced Microelectronics | 图书封面 |  | 描述 | Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing. | 出版日期 | Book 2003 | 关键词 | Dielectric Materials; Integrated circuit manufacture; Interconnects; Low dielectric constant; Permittivi | 版次 | 1 | doi | https://doi.org/10.1007/978-3-642-55908-2 | isbn_softcover | 978-3-642-63221-1 | isbn_ebook | 978-3-642-55908-2Series ISSN 1437-0387 Series E-ISSN 2197-6643 | issn_series | 1437-0387 | copyright | Springer-Verlag Berlin Heidelberg 2003 |
The information of publication is updating
|
|