Titlebook: Lead Free Solder; Mechanics and Reliab John Hock Lye Pang Book 2012 Springer Science+Business Media, LLC 2012 Creep models.Fatigue Models.L

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John Hock Lye Pang care robots could be a potent solution to meet shortcomings in the health care sector. Even though the potential of robotic home care assistance is promising, the question if older persons would accept a robotic assistance at home is still underexplored. Adopting a three-step procedure, older adult

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J. H. L. Pangand experiences that raise their qualities of living. Therefore a solution to enhance ecotourism experiences of the advanced age group would be a major consideration in the future. A tendency of elevating knowledge and experiences of the active aging group with assistance of technology is anticipate

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constructions to the interactive information output from the perspective of interaction mechanism according to interactive demands on the basis of the life styles, behavioral characteristics and behavior patterns of the elderly population. The structure form is manifested as cognitiom-understanding-

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s theory in elastic, plastic, creep, fatigue and fracture as.Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, n

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Introduction,models for creep and viscoplastic analysis, fatigue life prediction models, which are then employed in a finite element modeling and simulation analysis to assess the solder joint reliability performance.

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Thermal Cycling Aging Effects on Board-Level Drop Test Result,sult in IMC growth and thermal fatigue damage. The IMC growth, as well as the void/crack formation subject to thermal cycling aging will affect the long-term solder joint reliability performance. It can also affect the impact shock reliability as thicker IMC layer causes brittle fracture failure.

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Theory on Mechanics of Solder Materials,theory on mechanics of solder materials will focus on elastic-plastic-creep and viscoplastic models for describing the thermo-mechanical deformation response of lead-free solder materials operating over a wide range of temperatures (−40°C to +125°C) and strain rates (0.0001–1,000 s.).