| 书目名称 | Lead Free Solder | | 副标题 | Mechanics and Reliab | | 编辑 | John Hock Lye Pang | | 视频video | | | 概述 | Discusses lead-free solder materials industry their selection and how they are currently used industry wide.Focuses on mechanics of materials theory in elastic, plastic, creep, fatigue and fracture as | | 图书封面 |  | | 描述 | .Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards.. Lead Free Solder: Mechanics and Reliability. provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.. | | 出版日期 | Book 2012 | | 关键词 | Creep models; Fatigue Models; Lead-Free Solder; Mechanics of Materials; Solder Joint | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4614-0463-7 | | isbn_softcover | 978-1-4899-9116-4 | | isbn_ebook | 978-1-4614-0463-7 | | copyright | Springer Science+Business Media, LLC 2012 |
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发表于 2025-3-21 19:14:56
