Titlebook: Investigation on SiGe Selective Epitaxy for Source and Drain Engineering in 22 nm CMOS Technology No; Guilei Wang Book 2019 Springer Natur

空气

promote

Epitaxial Growth of SiGe Thin Films,ical vapor deposition (RPCVD) technology. The selective epitaxial growth of high quality strained SiGe films has been studied in detail, and key factors affecting the epitaxial quality and strain for epitaxial grown films has been investigated.

Permanent

Pattern Dependency of SiGe Layers Selective Epitaxy Growth,n the performance of transistors. Thus, the research on pattern dependency of SiGe layers grown selectively in 22 nm planar structure and 16 nm FinFET is necessary, which will provide a good foundation for large-scale advanced device integration and application.

入伍仪式

Book 2019lling. .As the CMOS technology roadmap calls for continuously downscaling traditional transistor structures, controlling the parasitic effects of transistors, e.g. short channel effect, parasitic resistances and capacitances is becoming increasingly difficult. The emergence of these problems sparked

枫树

2190-5053 n source and drain technology for the 22 nm CMOS node and beThis thesis presents the SiGe source and drain (S/D) technology in the context of advanced CMOS, and addresses both device processing and epitaxy modelling. .As the CMOS technology roadmap calls for continuously downscaling traditional tran

圆木可阻碍

SiGe S/D Integration and Device Verification,pitaxy in S/D of 22 nm planar transistors and 16 nm FinFET have been studied. The strain distribution by SiGe in S/D regions is analyzed. Finally, the electrical measurements of 22 nm planar transistors and 16 nm FinFET devices with integrated SiGe S/D are presented.

Immunization

听觉

Strained Silicon Technology, the thickness limit of 1 nm. This scaling trend brings issues about power consumption, transistor density and off-leakage current, together with carrier mobility degradation. Furthermore, the continuous scaling-down of device dimensions and further performance enhancement are facing more and more s

Morose

bonnet

SiGe S/D Integration and Device Verification,b 90 nm technology generations, strain has been used to improve the channel mobility of PMOS devices. In this chapter, integration of SiGe selective epitaxy in S/D of 22 nm planar transistors and 16 nm FinFET have been studied. The strain distribution by SiGe in S/D regions is analyzed. Finally, the