找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Integrated Circuit Test Engineering; Modern Techniques Ian A. Grout Textbook 2006 Springer-Verlag London 2006 Hardware.SPICE.Transistor.Win

[复制链接]
楼主: 分类
发表于 2025-3-23 11:50:33 | 显示全部楼层
发表于 2025-3-23 15:26:23 | 显示全部楼层
发表于 2025-3-23 18:52:39 | 显示全部楼层
发表于 2025-3-23 22:59:31 | 显示全部楼层
System on a Chip (SoC) Test, once manufactured as a discrete chip-set on a printed circuit board within the single IC itself. A system once composed of multiple ICs can now be realised within a single IC, providing for physical size reduction, and leading to increased operating speed and portability for mobile applications. Th
发表于 2025-3-24 04:52:00 | 显示全部楼层
Test Pattern Generation and Fault Simulation,onal test. Structural tests are based on the development of test vectors to detect specific faults that are considered to exist in a circuit due to process defects. The generation of the necessary test vectors is undertaken using test pattern generation and fault simulation techniques and tools.
发表于 2025-3-24 09:13:01 | 显示全部楼层
Automatic Test Equipment (ATE) and Production Test, defect levels. The tests undertaken in production must be suitably comprehensive, but at the lowest cost possible. The role of the physical test equipment is essential to achieving this. During production test, Automatic Test Equipment (ATE) is used to reduce the test times by automating as much of
发表于 2025-3-24 10:48:44 | 显示全部楼层
Test Economics,to identify the cost to test, the different parts that go into the creation and operation of a production test program must be identified, and a value associated with that part. A test economics model can be created which will allow for these costs to be formally defined and analysed.
发表于 2025-3-24 16:42:42 | 显示全部楼层
Textbook 2006. encapsulates the subject as it stands today. After introductory background from basic testing rules to trends in technology, the reader learns about: fabrication processes; a complete range of detailed tests and procedures; how to design for testability; fault simulation; automatic test equipment
发表于 2025-3-24 20:48:59 | 显示全部楼层
发表于 2025-3-25 01:06:37 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-5-20 08:32
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表