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Titlebook: Evaluation of Advanced Semiconductor Materials by Electron Microscopy; David Cherns Conference proceedings 1989 Plenum Press, New York 198

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书目名称Evaluation of Advanced Semiconductor Materials by Electron Microscopy
编辑David Cherns
视频video
丛书名称NATO Science Series B:
图书封面Titlebook: Evaluation of Advanced Semiconductor Materials by Electron Microscopy;  David Cherns Conference proceedings 1989 Plenum Press, New York 198
描述The last few years have ~een rapid improvements in semiconductor growth techniques which have produced an expanding range of high quality heterostructures for new semiconductor devises. As the dimensions of such structures approach the nanometer level, it becomes increasingly important to characterise materials properties such as composition uniformity, strain, interface sharpness and roughness and the nature of defects, as well as their influence on electrical and optical properties. Much of this information is being obtained by electron microscopy and this is also an area of rapid progress. There have been advances for thin film studies across a wide range of techniques, including, for example, convergent beam electron diffraction, X-ray and electron energy loss microanalysis and high spatial resolution cathodoluminescence as well as by conventional and high resolution methods. Important develop­ ments have also occurred in the study of surfaces and film growth phenomena by both microscopy and diffraction techniques. With these developments in mind, an application was made to the NATO Science Committee in late summer 1987 to fund an Advanced Research Work­ shop to review the elec
出版日期Conference proceedings 1989
关键词crystal; electron; electron microscope; microscopy; scattering; segregation; semiconductor; transmission el
版次1
doihttps://doi.org/10.1007/978-1-4613-0527-9
isbn_softcover978-1-4612-7850-4
isbn_ebook978-1-4613-0527-9Series ISSN 0258-1221
issn_series 0258-1221
copyrightPlenum Press, New York 1989
The information of publication is updating

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Transmission Electron Microscopy and Transmission Electron Diffraction Studies of Atomic Ordering intes such as InP or GaAs. A variety of growth techniques are used to produce these epitaxial layers such as liquid phase epitaxy (LPE), vapour phase epitaxy (VPE), molecular beam epitaxy (MBE) and organometallic vapour phase epitaxy (OMVPE).
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https://doi.org/10.1007/978-3-322-87537-2ntermixes with Gallium and gives rise to a thicker film, InGaAs, the Indium proportion being at least 50 %. The interface InAs/GaAs is atomically flat, whereas the interface GaAs/InAs is extremely rough. This may be a way of decreasing the elastic energy.
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,Teilsystem zur Therapiedurchführung,ues can produce rather accurate results.. An urgent need exists, however, for a method which can be applied to non-centrosymmetric semiconductors and other materials which are crystalline only on a sub-micron scale.
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High Resolution Electron Microscopy Study of Indium Distribution in InAs/GaAs Multilayersntermixes with Gallium and gives rise to a thicker film, InGaAs, the Indium proportion being at least 50 %. The interface InAs/GaAs is atomically flat, whereas the interface GaAs/InAs is extremely rough. This may be a way of decreasing the elastic energy.
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Convergent Beam Electron Diffraction Studies of Defects, Strains and Composition Profiles in Semiconthod of examining superlattice reflections from both periodic and irregular multilayer structures and studies of single quantum well samples of AlGaAs/GaAs and InP/InGaAs, which give well thicknesses to near monolayer precision, are also described.
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Measurement of Structure-Factor Phases by Electron Diffraction for the Study of Bonding in Non-Centrues can produce rather accurate results.. An urgent need exists, however, for a method which can be applied to non-centrosymmetric semiconductors and other materials which are crystalline only on a sub-micron scale.
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0258-1221 terostructures for new semiconductor devises. As the dimensions of such structures approach the nanometer level, it becomes increasingly important to characterise materials properties such as composition uniformity, strain, interface sharpness and roughness and the nature of defects, as well as thei
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