Titlebook: Electrical Design of Through Silicon Via; Manho Lee,Jun So Pak,Joungho Kim Book 2014 Springer Science+Business Media Dordrecht 2014 3-Dime

强所

Thermal Effects on TSV Signal Integrity,e hundreds-of-MHz frequency range, increasing temperature decreases the S. of TSV channel, but over that frequency range, increasing temperature increases the S.. These phenomena are explained from the model which thermal dependence of the materials is applied.

小步舞

Power Distribution Network Modeling and Analysis for TSV and Interposer-Based 3D ICs in the Frequen interposer-based 3D ICs in the frequency domain with respect to the variations in the main design issues for the PDNs such as the size of grid-type PDNs, the number of power/ground (P/G) TSVs, and the capacitance of the on-chip decoupling capacitors (on-chip decaps).

Hay-Fever

费解

https://doi.org/10.1007/978-3-642-91504-8ng TSV, shielding bump. These methods are compared by showing shielding effectiveness, design restriction, consuming area, and manufacturing process compatibility and the several design guides are provided for choosing the adequate and best way among TSV noise coupling reduction methods considering real products.

Cpr951

Noise Coupling and Shielding in 3D ICs,ng TSV, shielding bump. These methods are compared by showing shielding effectiveness, design restriction, consuming area, and manufacturing process compatibility and the several design guides are provided for choosing the adequate and best way among TSV noise coupling reduction methods considering real products.

Mere仅仅

this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered..978-94-017-7949-4978-94-017-9038-3

HPA533

https://doi.org/10.1007/978-3-662-35217-5mented using TSV technologies. In this chapter, TSV decoupling schemes are introduced, showing that they have prominent advantages relative to reducing the inductive power distribution network (PDN) impedance and suppressing power noise such as the simultaneously switching noise (SSN) in the 3D ICs.

cultivated

TSV Decoupling Schemes,mented using TSV technologies. In this chapter, TSV decoupling schemes are introduced, showing that they have prominent advantages relative to reducing the inductive power distribution network (PDN) impedance and suppressing power noise such as the simultaneously switching noise (SSN) in the 3D ICs.

Harness

https://doi.org/10.1007/978-94-017-9038-33-Dimensional Integrated Circuit Design; Clock Distribution Networks; High Speed IC Design; Noise Coupl

尊严