| 书目名称 | Electrical Design of Through Silicon Via |
| 编辑 | Manho Lee,Jun So Pak,Joungho Kim |
| 视频video | |
| 概述 | Provides fundamental modeling of TSV which is a very essential part of 3D ICs.Includes both numerical formula analysis and qualitative explanations.Approach from various view points: signal integrity, |
| 图书封面 |  |
| 描述 | .Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.. |
| 出版日期 | Book 2014 |
| 关键词 | 3-Dimensional Integrated Circuit Design; Clock Distribution Networks; High Speed IC Design; Noise Coupl |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-94-017-9038-3 |
| isbn_softcover | 978-94-017-7949-4 |
| isbn_ebook | 978-94-017-9038-3 |
| copyright | Springer Science+Business Media Dordrecht 2014 |
发表于 2025-3-21 17:53:53
