Titlebook: Electrical Design of Through Silicon Via; Manho Lee,Jun So Pak,Joungho Kim Book 2014 Springer Science+Business Media Dordrecht 2014 3-Dime

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Electrical Modeling of a Through Silicon Via,annel bandwidth and high density integration capability simultaneously. As for the vertical interconnect for a 3D IC, through-silicon via (TSV) is a key component which can provide a significant performance improvement with greatly reduced physical length of channels among vertically integrated chip

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Thermal Effects on TSV Signal Integrity,licon via (TSV) noise coupling and S. of TSV channel were measured in both frequency and time domain from corresponding TSV based test vehicle. These measurement results are analyzed using the temperature-dependent TSV lumped model to TSV channel and shows good correlation with measurement. Under th

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J. Soosai Raj,A. Mayavel,V. N. Mutharaian,A. Nicodemuss featuring business processes and remote services invocation. Process- and service-enabled Web applications benefit from the high-level modeling and automatic code generation techniques that have been fruitfully applied to conventional Web applications, broadening the class of Web applications that

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The Theory of Joint Play: Distance and Coherence,ge of movement in a joint. There are two kinds of involuntary movements: passive movement in the same direction as active angular movements, and uncontrolled movements along a plane tangential to the joint surface in directions not given (translatory movements).

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Vom Quantenregister zum Quantenschaltkreis,Dieses Kapitel legt notwendige Grundlagen für Verständnis und Entwicklung von Quantenverfahren; es enthält aber auch einige überraschende Ergebnisse. Wir beginnen mit einem Schnellkurs „Laufzeitanalyse von Algorithmen“.