Titlebook: Electrical Conductive Adhesives with Nanotechnologies; Yi Li,Daniel Lu,C. P. Wong Book 2010 Springer-Verlag US 2010 electrical conductive

知道

Future Trend of Conductive Adhesive Technology,As can be seen from previous chapters, tremendous progress has beenmade to improve the conductive adhesive technology for ICAs, ACA, andNCA.

一再烦扰

Habituate

https://doi.org/10.1007/978-3-658-23006-7ansfer images and patterns from a mask to the surface of a wafer or substrate. The steps typically involved in the photolithographic process are wafer or substrate cleaning, barrier layer formation, photoresist application, soft baking, mask alignment, exposure and development, and hard-baking.

符合国情

Anisotropically Conductive Adhesives/Films (ACA/ACF),such as metallic particles or metal-coated polymer spheres. ACAs/ACFs provide unidirectional electrical conductivity in the vertical or Z-axis. This directional conductivity is achieved by using a relatively low-volume loading of conductive filler (5–20 volume percent) [1-3].

Congeal

极力证明

Immunoglobulin

http://image.papertrans.cn/e/image/305707.jpg

放大

FLAT

Brain-Waves

Grundlagen des Sedimenttransportsated with other components into a system-level board. “Electronic Packaging” is defined as the bridge that interconnects the integrated circuits (ICs) and other components into a system-level board to form electronic products [1]. The packaging has four main functions: (1) signal distribution, mainl