书目名称 | Electrical Conductive Adhesives with Nanotechnologies | 编辑 | Yi Li,Daniel Lu,C. P. Wong | 视频video | | 概述 | Compares and contrasts lead-free soldering techniques and electrically conductive adhesives and discusses the advantages of electrically conductive adhesives.Discusses isotropically conductive adhesiv | 图书封面 |  | 描述 | .“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.. | 出版日期 | Book 2010 | 关键词 | electrical conductive adhesives; electronic devices; electronic packaging; integrated circuit; lead-free | 版次 | 1 | doi | https://doi.org/10.1007/978-0-387-88783-8 | isbn_softcover | 978-1-4899-8307-7 | isbn_ebook | 978-0-387-88783-8 | copyright | Springer-Verlag US 2010 |
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