Titlebook: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging; Materials, Processes Kim S. Siow Book 2019 Springer N

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Process Control of Sintered Ag Joint in Production for Die Attach Applications, tools to enable this control and reliability tests. The primary process steps of sintered Ag joints are substrate/wafer printing, preheating, die laminating, placement, and pressure sintering. Unlike solder joint, sintered Ag joint does not form intermetallic with the common substrates used in the

Coronation

consent

judiciousness

Morphological Changes in Sintered Silver Due to Atomic Migration,ature stability of the material at temperatures above 200 °C. Particular aspects that are of interest include the effects of porosity and electromigration. The presence of pores results in a high internal surface area which allows surface diffusion to take place. Grain boundaries also facilitate fas

有恶意

florid

Sintered Copper (Cu): Chemistry, Process, and Reliability,lectrical properties than other sintered or solder joints. Their thermal characteristics and and reliability, i.e. power cycle and thermal cycle tests, are investigated in this chapter..The Cu nanoparticles with fatty acids and amines were fabricated and examined in ir thermal and reliability tests.

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