| 书目名称 | Die-Attach Materials for High Temperature Applications in Microelectronics Packaging | | 副标题 | Materials, Processes | | 编辑 | Kim S. Siow | | 视频video | | | 概述 | Addresses the differences between sintering and soldering (the current die-attach technologies) thereby comprehensively addressing principles, methods, and performance of these high-temperature die-at | | 图书封面 |  | | 描述 | .This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys..Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;.Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;.Simulta | | 出版日期 | Book 2019 | | 关键词 | Sintered silver; Nano-silver sintering; Low temperature joining technology; Lead-free die attach; Power | | 版次 | 1 | | doi | https://doi.org/10.1007/978-3-319-99256-3 | | isbn_ebook | 978-3-319-99256-3 | | copyright | Springer Nature Switzerland AG 2019 |
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发表于 2025-3-21 16:51:03
