Titlebook: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging; Materials, Processes Kim S. Siow Book 2019 Springer N

摆动

Emerich Berghofer,Regine Schoenlechnerlar in approach and implementation but different in the underlying theory—are discussed in the context of high-temperature bonded materials. In addition, a short review of sintered silver is provided, as it is widely seen as a potentially promising and reliable bonded material for high-temperature a

口音在加重

John R. N. Taylor,Mary L. Parkerys dealing with patent infringement cases related to nano-materials in the USA, as well as scientists and engineers who are working in the manufacturing industry to appreciate the DOE and PHE while analyzing the relevant patents in their job.

钱财

油膏

纪念

Book 2019erformance of these high-temperature die-attach materials;.Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;.Simulta

CHANT

Die-Attach Materials for High Temperature Applications in Microelectronics PackagingMaterials, Processes

小教堂

扩音器

ective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;.Simulta978-3-319-99256-3

摄取

Silver Sintering and Soldering: Bonding Process and Comparison,hybrid/electric vehicles, high-speed train, aircraft/aviation, and deep well oil/gas extraction. This chapter focuses on elucidation of the joint formation processes of silver sintering and solder, as well as their comparison. The driving force of silver sintering is particle surface energy reductio

规章

Sintered Silver for LED Applications,mance, environmental-friendly properties, and economical operation cost..In this chapter, various LED die-attach materials are introduced and compared. A conclusion is drawn after the discussions, that is, as an advanced technique for LED die attachment, sintered Ag matches well with the requirement