Titlebook: Copper Interconnect Technology; Tapan Gupta Book 2009 Springer-Verlag New York 2009 circuit performance.copper/low-k technology.cu interco

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Coping and Living with Cervical Cancer,c material) to separate the .. Besides being an insulating material for interconnecting lines, SiO. has been used also as a gate material in metal oxide semiconductor (MOS) devices. As a matter of fact, Al coupled with SiO. has become the workhorse of IC technology.

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Coping and Living with Cervical Cancer,et (DUV) lithography. Figure 4.1 shows a picture of the trenches produced by using DUV resist and phase-shift mask (PSM). The resist images show a .. factor as small as 0.25 (the 2004 ITRS requirement for technology node is . and is expected to be . by the year 2007, where .).

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Coping and Living with Cervical Cancer, Cu is difficult and photoresist work cannot withstand the temperatures required for Cu-etching (>200 ºC). Moreover, wet etching and lift-off techniques of Cu have been attempted without much success. So a new process technology known as the . process has been introduced to integrate Cu-interconnects in modern integrated circuits (ICs).

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