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SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

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Submitted on: 24 April 2005. Revised on: 02 July 2005. Accepted on: 27 July 2005. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 20 May 2003. Revised on: 23 July 2003. Accepted on: 15 September 2003. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 10 July 2006. Revised on: 06 August 2006. Accepted on: 15 September 2006. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 24 October 2005. Revised on: 21 January 2006. Accepted on: 27 February 2006. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 28 July 2011. Revised on: 20 November 2011. Accepted on: 13 December 2011. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 25 April 1998. Revised on: 12 July 1998. Accepted on: 26 July 1998. ___________________JOURNAL OF ELECTRONIC PACKAGING
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