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SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

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Submitted on: 23 July 2016. Revised on: 04 November 2016. Accepted on: 17 December 2016. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 27 March 2013. Revised on: 01 July 2013. Accepted on: 13 August 2013. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 10 March 2015. Revised on: 30 May 2015. Accepted on: 29 June 2015. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 30 January 2002. Revised on: 05 April 2002. Accepted on: 16 April 2002. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 02 September 2013. Revised on: 24 October 2013. Accepted on: 15 December 2013. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 25 October 2008. Revised on: 21 January 2009. Accepted on: 03 March 2009. ___________________JOURNAL OF ELECTRONIC PACKAGING
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