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派博传思国际中心 »期刊书目

› Journal of SCIE
› ENGINEERING, MECHANICAL(工程，机械)

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SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

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发表于 2025-3-21 19:31:57 | 显示全部楼层 |阅读模式
期刊全称JOURNAL OF ELECTRONIC PACKAGING
期刊简称J ELECTRON PACKAGING
影响因子20242.203
视频video
ISSN1043-7398
eISSN1528-9044
出版商ASME
发行地址TWO PARK AVE, NEW YORK, USA, NY, 10016-5990
学科分类1.Science Citation Index Expanded (SCIE)--Engineering, Electrical & Electronic | Engineering, Mechanical; 2.Current Contents Electronics & Telecommunications Collection--Signal Processing/Circuits & Systems; 3.Current Contents Engineering, Computing & Technology--Mechanical Engineering; 4.Essential Science Indicators--Engineering;
出版语言English
The information of publication is updating

SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)影响因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)影响因子@(工程，机械)学科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)总引论文


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)总引论文@(工程，机械)学科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)影响因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)总引频次@(工程，机械)学科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)即时影响因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)即时影响因子@(工程，机械)学科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)五年累积影响因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)五年累积影响因子@(工程，机械)学科排名


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Submitted on: 02 May 2015. Revised on: 06 August 2015. Accepted on: 05 September 2015. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 20 March 2023. Revised on: 25 June 2023. Accepted on: 20 August 2023. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 18 January 2018. Revised on: 31 March 2018. Accepted on: 06 May 2018. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 12 April 2002. Revised on: 04 May 2002. Accepted on: 16 June 2002. ___________________JOURNAL OF ELECTRONIC PACKAGING
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Submitted on: 18 July 2000. Revised on: 19 October 2000. Accepted on: 16 November 2000. ___________________JOURNAL OF ELECTRONIC PACKAGING
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