期刊全称 | Analysis and Simulation of Heterostructure Devices | 影响因子2023 | Vassil Palankovski,Rüdiger Quay | 视频video | | 发行地址 | First full and comprehensive modeling of relevant compound semiconductors.Verified by precise simulation of real-state-of-the-art devices in over 25 different simulation examples.Bridges the gap betwe | 学科分类 | Computational Microelectronics | 图书封面 |  | 影响因子 | Communication and information systems are subject to rapid and highly so phisticated changes. Currently semiconductor heterostructure devices, such as Heterojunction Bipolar Transistors (HBTs) and High Electron Mobility Transis tors (HEMTs), are among the fastest and most advanced high-frequency devices. They satisfy the requirements for low power consumption, medium integration, low cost in large quantities, and high-speed operation capabilities in circuits. In the very high-frequency range, cut-off frequencies up to 500 GHz [557] have been reported on the device level. HEMTs and HBTs are very suitable for high efficiency power amplifiers at 900 MHz as well as for data rates higher than 100 Gbitfs for long-range communication and thus cover a broad range of appli cations. To cope with explosive development costs and the competition of today‘s semicon ductor industry, Technology Computer-Aided Design (TCAD) methodologies are used extensively in development and production. As of 2003, III-V semiconductor HEMT and HBT micrometer and millimeter-wave integrated circuits (MICs and MMICs) are available on six-inch GaAs wafers. SiGe HBT circuits, as part of the CMOS technology on eig | Pindex | Book 2004 |
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