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Titlebook: Advanced Thermal Management Materials; Guosheng Jiang,Liyong Diao,Ken Kuang Book 2013 Springer Science+Business Media New York 2013 Alumin

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发表于 2025-3-21 16:30:44 | 显示全部楼层 |阅读模式
期刊全称Advanced Thermal Management Materials
影响因子2023Guosheng Jiang,Liyong Diao,Ken Kuang
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发行地址Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management.Discusses numerical simulation methods and techniques
图书封面Titlebook: Advanced Thermal Management Materials;  Guosheng Jiang,Liyong Diao,Ken Kuang Book 2013 Springer Science+Business Media New York 2013 Alumin
影响因子.Advanced Thermal Management Materials. provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Pindex Book 2013
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发表于 2025-3-21 22:25:29 | 显示全部楼层
Sie schreiben einen Namen in den Himmel,fibers, and SiC fibers. The development of a Cu–C. composite and aluminum graphite materials is presented. Finally, copper/molybdenum/copper (CMC), copper/molybdenum–copper/copper (CPC), and Cu/Invar/Cu (CIC) materials are introduced.
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Book 2013uring processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
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发表于 2025-3-23 03:24:25 | 显示全部楼层
Maria Boratyńska,Przemysław Konieczniakporosity, and temperature on thermal conductivity are presented. In the following section, we will introduce methods to measure thermal conductivity, the coefficient of thermal expansion, and hermeticity. Finally, the emergence of quality requirements for thermal management materials are discussed.
发表于 2025-3-23 05:37:44 | 显示全部楼层
https://doi.org/10.1007/978-3-531-92807-4/CPC composite manufacturing technologies such as hot rolling lamination, explosive forming, and laser cladding. Finally, we will discuss the WCu and MoCu microelectronics packaging material manufacturing technologies research diagram and present detailed descriptions of each step.
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