Titlebook: Wafer Bonding; Applications and Tec Marin Alexe,Ulrich Gösele Book 2004 Springer-Verlag Berlin Heidelberg 2004 Compound semiconductors.Diod

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0933-033X specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.978-3-642-05915-5978-3-662-10827-7Series ISSN 0933-033X Series E-ISSN 2196-2812

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Wafer Bonding of Ferroelectric Materials,onductors of technological potential would be highly desirable. Beside the memory effect, the photoelectric and pyroelectric effects in ferroelectricsemiconductor heterostructures [1,2] could be promising for developing new types of integrated detectors.