Overview: Rapid thermal and integrated processing is an emergingsingle-wafer technology in ULSI semiconductor manufacturing,electrical engineering, applied physics and materials science. Here,the physics and engineering of this technology are discussed at thegraduate level. Three interrelated areas are covered. First, thethermophysics of photon-induced annealing of semiconductor and relatedmaterials, including fundamental pyrometry and emissivity issues, themodelling of reactor designs and processes, and their relation totemperature uniformity. Second, process integration, treating theadvances
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