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Titlebook: Variation Tolerant On-Chip Interconnects; Ethiopia Enideg Nigussie Book 2012 Springer Science+Business Media, LLC 2012 Analog Circuits and

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Design of Delay-Insensitive Current Sensing Interconnects,hange information using handshakes to explicitly indicate the validity and acceptance of data. Depending on the type of handshaking, data encoding, channel type, and data-validity schemes there are a number of alternative communication protocols. As already discussed in Chap.??, two-phase handshakin
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Comparison of the Designed Interconnects,e interconnects are suitable for any kind of point-to-point on-chip communication, such as in a SoC to connect nearby or far away system blocks and in a NoC between two routers. The purpose of this chapter is to make a generalized summary of the presented interconnects as well as comparisons between
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Circuit Techniques for PVT Variation Tolerance,ng process imperfections. Whereas, environmental variations occur during the operation of a circuit and includes dynamic variations in the supply VT. Precise control of the manufacturing process is worsening with technology scaling due to smaller dimensions, smaller number of doping atoms and aggres
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Comparison of the Designed Interconnects, a NoC between two routers. The purpose of this chapter is to make a generalized summary of the presented interconnects as well as comparisons between them. In order to do so, all interconnects are redesigned and simulated in 65nm CMOS technology from STMicroelectronics with 1V supply voltage.
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Energy Efficient Semi-Serial Interconnect,eferable in terms of wiring area and incurs less routing congestion than parallel links. The serial link also takes smaller active area and consumes less leakage and dynamic power than the parallel link for long global communication [109].
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1872-082X esign techniques to mitigate problems caused by variation.InThis book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increas
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